Ming-Li Precision Manufactures Power Module Frames & Housings for ITRI

PROJECT HIGHLIGHT · POWER ELECTRONICS · OCTOBER 2026

Ming-Li Precision has recently manufactured a new set of Power Module Frames & Housings for Taiwan’s Industrial Technology Research Institute (ITRI), showcasing its expertise in precision mold engineering, metal insert molding and complex plastic components for power electronics.

Supporting the Next Generation of Power Electronics Packaging

Power module frames and housings do far more than provide an external enclosure. They help position electrical terminals, maintain mechanical interfaces and support insulation-related design requirements within increasingly compact power semiconductor assemblies. As electric mobility, industrial drives and energy conversion systems evolve, manufacturers need components that balance detailed geometries, reliable insert positioning and repeatable molding quality.

In this recent ITRI project, Ming-Li manufactured a multi-part frame and housing configuration with embedded metal features. According to ITRI, these power module frames and housings are intended for use in energy storage or charging equipment. The photographs illustrate the component architecture, including exposed terminals, fine contact patterns, corner mounting features and the mating frame-and-cover arrangement.

Precision Metal Insert Molding Meets Complex Housing Geometry

Producing power module frames with multiple metal terminals requires careful coordination between insert design, tooling layout and molding process control. Important engineering considerations include terminal positioning, plastic-to-metal interfaces, dimensional stability, assembly fit and the protection of delicate features during production.

Ming-Li combines high-precision mold manufacturing with metal insert molding and overmolding to support these demanding structures. Depending on the customer's electrical, thermal and mechanical specifications, suitable engineering polymers and tooling concepts can be evaluated during design for manufacturability (DFM).

From DFM and Tooling to Inspection-Ready Production

For power module packaging projects, manufacturability should be considered from the earliest design stage. Ming-Li's broader engineering capabilities cover DFM and Moldflow analysis, precision tooling, injection molding and dimensional verification. Its metrology resources include ZEISS 3D X-ray CT inspection, which can be applied when internal features or insert placement require non-destructive evaluation.

With experience across more than 100 power module housing mold projects and an IATF 16949-certified quality management system, Ming-Li supports customers seeking a manufacturing partner for technically demanding plastic-and-metal components.

Engineering Relevance Across IGBT and SiC Applications

Although the detailed specifications of each power module are application-specific, similar frame and housing manufacturing capabilities are relevant to IGBT and SiC module packaging used in EV powertrains, DC charging, industrial power conversion and renewable-energy equipment. Each design must be evaluated against its own electrical insulation, thermal, material and assembly requirements.

This ITRI manufacturing case adds another practical example to Ming-Li's portfolio of Power Module Frames & Housings solutions, demonstrating how precise tooling and insert molding can support complex power electronics packaging.

Project images: Ming-Li Precision. Product specifications and material selections are project-dependent.