Ming-Li Precision Exhibits Power Modules Housing at 2024 Taiwan International Semiconductor Exhibition

Taipei, Taiwan – September 2024
Ming-Li Precision has proudly showcased its latest Power Modules Housing at the 2024 Taiwan International Semiconductor Exhibition, held at the Industrial Technology Research Institute (ITRI) booth. The featured product on display was a 3-Phase 1200V 500A SiC Power Module, demonstrating the company's advanced capabilities in precision manufacturing for high-power electronic components.

The Power Modules Housing by Ming-Li Precision is a critical component designed for the protection and integration of power modules in semiconductor applications. These housings ensure efficient heat dissipation, mechanical stability, and enhanced durability, all while maintaining the highest standards of electrical insulation.

As SiC (Silicon Carbide) technology continues to gain traction in high-efficiency power electronics, the need for robust housing solutions has become essential. Ming-Li Precision’s contribution to this emerging market is a testament to its engineering excellence and commitment to supporting the semiconductor industry’s evolving demands.

This exhibition serves as an excellent platform for Ming-Li Precision to display its world-class precision molding and manufacturing solutions to industry leaders and experts. The company’s Power Modules Housing is expected to be an integral part of future developments in electric vehicles, renewable energy systems, and industrial power systems.

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